On January 8th, TI launched a new integrated car chip that can help drivers of vehicles at all prices achieve a safer and more immersive driving experience.
The TI AWRL6844 60GHz millimeter wave radar sensor supports occupancy detection, in-car child detection and intrusion detection for seat belt reminder systems through a single chip that runs the edge AI algorithm, thus achieving a safer driving environment.
With TI’s next-generation audio DSP core, AM275x-Q1 MCU, and AM62D-Q1 processors, a high-quality audio experience is more affordable.
Combined with TI’s new analog products, including TAS6754-Q1 Class D audio amplifiers, engineers can get a complete audio amplification system solution.
Photo: TI,TI shows the devices at the Consumer Electronics Show (CES) in Las Vegas, Nevada, USA, January 7-10, 2025.
“Today’s drivers expect these vehicles to provide a better in-car experience, whether they are entry-level or luxury cars, fuel vehicles or electric vehicles,” said Amichai Ron, senior vice president of embedded processing at TI.
“TI continues to provide innovative technologies designed to promote the development and improvement of the future driving experience.
Our edge AI radar sensors help automakers improve the safety of their vehicles and respond quickly to the movements and needs of drivers, while our on-chip audio system provides a more immersive audio experience, making driving fun.
Together, they create a whole new in-car experience.
” Three-in-one radar sensors that support edge AI improve detection accuracy, and original equipment manufacturers (OEM) are constantly integrating more sensor technologies into vehicle design to enhance the in-vehicle experience and meet evolving safety standards.
Using TI’s AWRL6844 60GHz millimeter wave radar sensor with edge AI, engineers can integrate three in-vehicle inspection functions to replace a variety of sensor technologies (for example, seat weight pads and ultrasonic sensors).
AWRL6844 integrates four transmitters and four receivers to provide high-resolution detection data, and the cost is optimized, making it ideal for OEM to input the collected data into application-specific AI-driven algorithms, which run on customizable on-chip hardware accelerators and DSP, thus improving the accuracy of decision-making and speeding up data processing.
The edge intelligence of the AWRL6844 sensor helps improve the driving experience, for example, the sensor can detect and locate occupants with 98% accuracy during driving, thus supporting seat belt reminders.
After parking, it uses neural network technology to monitor whether there are unattended children in the car, and can detect small movements in the car in real time, with a classification accuracy of more than 90%.
This direct testing technology can help OEM meet the design requirements of the European Association for New vehicle Safety Evaluation (Euro NCAP) in 2025.
When the vehicle is parked, it adapts to different environments through intelligent scanning technology, thus reducing the false positives caused by the body shaking and the movement of external objects.
TI’s complete audio product line can provide a better car audio experience.
With the increasing expectations of drivers for the in-car experience of various models, OEM hopes to reduce design complexity and system cost while providing high-quality audio.
AM275x-Q1 MCU and AM62D-Q1 processors reduce the number of components required for automotive audio amplifier systems by integrating TI’s vector-based C7x DSP core, Arm ®core, memory, audio network, and hardware security modules into a SoC that meets functional security requirements.
The C7x core is combined with the matrix multiplication accelerator to form a neural processing unit, which is used to process traditional audio algorithms and audio algorithms based on edge AI.
These car audio SoC can be expanded, and designers can choose from entry-level to high-end systems according to different memory and performance requirements, with little redesign and no significant investment.
TI’s next-generation C7x DSP core has more than four times the processing performance of other audio DSP, allowing audio engineers to handle more audio functions at the same time on a single processor core.
The AM275x-Q1 MCU and AM62D-Q1 processors have spatial audio, active noise reduction, sound synthesis and advanced in-vehicle networking capabilities, including Ethernet audio and video bridging, enabling an immersive audio experience in the car.
To further optimize the automotive audio design, engineers can use TI’s TAS6754-Q1 audio amplifier, which uses innovative 1L modulation technology to achieve excellent audio performance and low power consumption, and requires half the number of inductors compared to existing Class D amplifiers.
The TAS67xx-Q1 family of devices integrates the real-time load diagnostics required by OEM to help engineers simplify design, reduce costs and improve efficiency, while ensuring that audio quality is not affected.
At CES 2025, TI demonstrated how its semiconductor technology redefines experiences by achieving higher levels of automation, intelligence, effectiveness, and performance-to-price ratio.
The show includes innovations in areas such as software-defined vehicles, advanced driving assistance systems, robots, wearable medical devices, energy infrastructure and personal electronics.
In addition, AWRL6844, AM2754-Q1, AM62D-Q1 and TAS6754-Q1 support pre-production and are now available for procurement through TI.
com, supporting multiple payment and shipping methods, and providing evaluation modules for all four devices.
, return to the first electric network home page >.
