On October 15, Galaxy was informed that Tesi Micro released a 3-in-1 low-power general-purpose MCU chip TCHV4018L.
The product supports 40V load voltage, LIN wake-up and other functions, which can solve the pain points in the current market, such as large control board area, excess MCU resources, high overall cost, poor system reliability and so on.
The market background, intelligence and electrification are the two mainstream directions of the development of the automobile market, and the requirement of intelligence poses a new challenge to the whole automobile electronic and electrical architecture.
Some island control units in the original architecture usually only need simple electrical control, which requires relatively low requirements for the external resources of the chip, but at the same time requires the remote node to have the ability to communicate with the domain control.
there are also some remote nodes that need to have certain computing power to localize the data collected by the sensor or simply control the execution unit and monitor its running status.
The traditional control architecture adopts a discrete scheme, with independent LIN transceivers, power supply LDO and MCU, and there are pain points such as large control board area, excess MCU resources, high overall cost, poor system reliability and so on.
The newly released TCHV4018L 3-in-1 products are created to solve the pain points in this industry.
Product features, l operating voltage 5.
5V~18V, support 40V load voltage, l deep sleep power consumption 70 microamps, support LIN wake up, l ARM Cortex M0 core, 48MHz high frequency clock, KB with ECC Flash and 4 KB SRAM,l integrated 5V/150mA and 1.
2V/10mA LDO for external use, l support 4 16 bit PWM output, l support 6 low voltage 3.
3V CMOS type GPIO and 3 voltage withstand to 5V open drain GPIO,l support 14 bit SARADC The highest sampling frequency 500KSPS, internal integrated PGA, up to 16 times gain, can realize the acquisition of 5-channel single-ended signals (including 1 pair of differential signals), l integrated 2-channel LIN interface to support both master and slave nodes, including one internal integrated transceiver, l supports 1-channel SPI interface The maximum communication rate is 20MHz.
LIN integrated transceiver physical layer and data link layer comply with LIN2.
x and J2602 standards, l LIN interface supports switching between 115Kbps high speed mode and 20Kbps conventional mode, l supports LIN SNPD automatic addressing function, l internal integrated temperature sensor, precision range ±10 °C, l power end meets ISO7637 and ISO16750 surge and transient voltage standards, l encapsulates DFN16 3mm*4mm 0.
4mm spacing, l AEC-Q100 Grade 1 Tjmax=-40 °C ~ 150C, internal block diagram of the chip, Fig.
1 system frame diagram, product advantage of peripheral resource optimization and cost performance ratio, through a comprehensive analysis of the demand characteristics of automobile terminal nodes, only 1 SARADC,4, PWM,1, SPI,6 CMOS GPIO (3.
3V), 3 OD GPIO (5V), 2 LIN SCI interfaces are provided.
Without the redundancy of any other peripherals, the area of the chip is greatly reduced and the performance-to-price ratio is improved.
Unlike other competitors in the industry using multi-wafer sealing structures, TCHV4018 uses a leading mixed-signal single wafer process that integrates high-voltage analog, embedded storage and other analog and digital peripherals into a single chip, which has outstanding advantages in performance, reliability, size and so on.
Low power consumption, thanks to the single chip design of TCHV4018L, the power consumption mode between internal units can be flexibly configured to meet the requirements of various application scenarios for power consumption mode, which typically supports LIN wake-up mode, and the standby power consumption of the chip can be less than 70uA, which can easily meet the power consumption requirements of almost all car factories for parts and components, and leave additional power margin for peripheral auxiliary protection circuits.
Small size, based on single chip design, and chip resources have been optimized so that the size of the whole product is only 3mm*4mm, compared with discrete and closed chip solutions, the advantage is very prominent.
Good LIN compatibility, TCHV4018L LIN transceiver and data link layer are designed based on taisi micro-mature LIN transceiver IP, which can well meet the latest LIN compatibility requirements such as LIN2.
X and SAEJ2602:2021.
Because of its excellent EMC characteristics, TCHV4018L focuses on EMC from the chip design stage, and adds necessary protective measures in power management and LDO circuit design to improve PSRR performance, making TCHV4018L easily pass the test of ISO7637 and ISO16750,ISO11452, CISPR25, SAEJ2962-1 and other related EMC standards.
Typical application scenarios, TCHV4018L has three main application directions: actuator node: DC motor, taillight, switch, sensor node: rainfall, bridge, ultrasound, door handle, kick, bridge extension application: LIN to LIN bridging, LIN to UART CAN bridging UART CAN to LIN bridging, figure 2 Intelligent Actuator Application, figure 3 Ultrasonic Radar Application, figure 4 rainfall Light Sensor Application, figure 5 LIN to LIN bridging Application, Ecology, tools and Technical support, in order to facilitate users to quickly evaluate the scheme and facilitate the rapid landing of the project, Taimi provides TCHV4018L EVK development board for users to apply, and provides a complete SDK development kit.
You can consult through sales@tinychip.com.cn for details.
, figure 6 ecological toolkit, return to the first electric network home page.
