On October 11, 2024 four-dimensional map new user conference was held in Guangzhou, four-dimensional map new CEO Cheng Peng released the four-dimensional map new NI In Car series intelligent driving product matrix, as well as the integrated chip of AC8025AE cabin and parking.
, Tu Yuan: Siwei Tuxin, in addition, at the conference, Siwei Tuxin strategic partner, Light Boat Intelligence Airlines, was unveiled.
Based on the new lightweight map HD Lite of four-dimensional map, combined with the high-order full-stack software algorithm of light boat Zhihang, the two sides jointly launched the urban NOA intelligent driving scheme, and carried out the road test video demonstration of many complex scenes in Beijing and Guangzhou.
Specifically, at this conference, Siwei Tu Xin focused on releasing the NI In Car series from entry-level to middle-and high-level smart driving product matrix, the first to launch the integrated travel and parking smart driving scheme based on the horizon journey ®6E/M.
According to reports, the integrated travel and parking smart driving scheme based on the journey ®6E/M chip includes full scene coverage of high-speed navigation auxiliary NOP, as well as intelligent upgrades of memory driving and memory parking.
The scheme is equipped with 7V3R12U sensor configuration to ensure the accuracy of data capture and the high efficiency and fluency of the processing process, coupled with the use of arithmetic fusion technology to improve the efficiency of the system.
Cheng Peng said that the scheme also builds a data-driven intelligent driving closed-loop system to continuously improve the driving experience and meet the personalized needs of users through technical means such as data compliance, mass source updates and continuous iteration.
The new integrated cabin and berth solution for the 100000-class model market was also unveiled for the first time.
The new four-dimensional map combines the self-developed AC8025 chip with Horizon Journey ®3 technology.
Through the innovative dual-domain integration design, the scheme not only significantly reduces the hardware cost, but also excavates the intrinsic value of computing power through efficient time-sharing reuse of functions and deep empowerment of data, supplemented by 5V5R sensor configuration, which shows excellent cost control ability in dual-domain fusion.
In terms of localization, the program has achieved a localization rate of 70%.
At the same time, Siwei Tu has launched an integrated cabin and berth solution based on Qualcomm Snapdragon SA8155 platform, which is designed for models in the 8-150000 range of the market.
Through the deep integration of the whole machine TBOX and the vehicle OTA engine carrier, the scheme realizes the highly integrated design at the system level.
It is worth mentioning that the scheme is a minimalist configuration from hardware to software, from chips to sensors.
Cheng Peng stressed that the production cost of the whole scheme can help car companies reduce costs by at least 20%.
In addition to the above, Siwei Tuxin also disclosed the business progress of its car, road and cloud integration, chips and so on.
In terms of car-road cloud integration, Siwei Tuxin has participated in the construction of car-road cloud in Beijing, Shenzhen, Hangzhou, Wuxi, Wuhan and other pilot cities.
In terms of chips, up to now, the shipments of Jefa Technology SoC chips under Siwei Tuxin have reached 85 million sets, and MCU chips have exceeded 60 million.
The AC8025 released last year has achieved mass production and has been designated by five international joint venture car companies and own-brand car companies.
Compared with the separation scheme of medium and low-order cockpit domain control and parking domain control, the new single-chip solution AC8025AE, which was launched at this user conference, has been optimized in many aspects, such as hardware, structure, heat dissipation, production and processing, wire harness and system software.
The program will be ready for mass production in 2025.
Cheng Peng pointed out that the AC8025AE chip adopts the advanced sealing form to repackage two mature chips into one, which not only shortens the development cycle, but also greatly reduces the cost, and ensures the maturity and reliability of the solution.
Tuyuan: Siwei Tuxin, at the end of the press conference, Cheng Peng said that car companies focus on mastering the core technology IP and knowledge, create a differentiated brand experience around the user experience, and fully cooperate with suppliers in collaborative development, which will not only help reduce costs and disperse risks, but also promote car companies to maintain high flexibility and competitiveness in market competition, and achieve “full stack control”.
At present, the total shipments of Siwei Tu’s new intelligent driving products exceed 1 million, and a total of more than 2 million have been designated and mass produced, providing smart driving solutions for seven car companies.
With the breakthrough of many new product solutions, the new transformation of four-dimensional map will be further accelerated, and its future blueprint will become more and more clear.
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